Low pressure molding has become an essential encapsulation process for protecting PCBA assemblies against moisture, vibration, chemicals, and temperature extremes. Unlike conventional high-pressure injection molding, which can damage delicate solder joints and fine-pitch components, low pressure molding injects thermoplastic hot-melt materials at gentle pressures to safely encapsulate the entire board. For electronics manufacturers, choosing the right partner for low pressure molding pcba is a decision that affects product reliability, certification compliance, and time to market.
Low pressure molding uses thermoplastic polyamide or polyolefin materials that are heated and injected at low pressure to form a protective shell around the circuit board assembly. The material solidifies within seconds upon cooling — no curing oven required. This process delivers several protection benefits:
Compared to potting with epoxy resins, pcba low pressure molding completes in seconds rather than hours. Compared to conformal coating, it provides thicker, more robust protection that can fully submerge and seal the board. The thermoplastic materials are also reworkable — they can be melted again for repairs — unlike cured epoxy compounds.
Farway operates a complete electronics manufacturing chain in a 2,000-square-metre production workshop in LongGang, Shenzhen. The service chain runs from PCB fabrication and component sourcing through SMT assembly, DIP through-hole welding, conformal coating, low pressure injection molding, PCBA testing, and finished product assembly. This integration means your boards move directly from assembly to encapsulation without leaving the facility — reducing handling risk, transit exposure, and overall lead time.
Farway's facility includes four low-pressure injection molding machines. Having multiple machines means the company can run different mold sizes and material grades in parallel rather than queueing everything through a single line. This dedicated capacity supports both prototype and production-volume encapsulation work.
Farway provides engineering support that spans the complete project lifecycle — from initial technical consulting and material selection through mold development and production. The engineering team covers electronic engineering, BOM engineering, structural engineering, electronic procurement, maintenance, and testing. This means design-for-manufacturing feedback is available before production begins, helping customers identify potential encapsulation issues — such as undercut areas, component height conflicts, or material flow paths — at the design stage rather than after molding.
Quality at Farway is backed by four management-system certifications:
The company follows IPC-A-610 as its PCBA assembly standard and works within UL, RoHS, SGS, and REACH compliance scopes. These certifications are directly relevant to low pressure injection molding pcba projects because they ensure process control, material traceability, and regulatory compliance — particularly for automotive and medical applications where certification evidence is mandatory.
Encapsulation is only as reliable as the verification behind it. Farway's testing portfolio includes AOI optical inspection, X-ray inspection, ICT circuit testing, FCT functional testing, thermal imaging inspection, and high- and low-temperature reliability testing. Every encapsulated PCBA can be functionally tested and inspected before shipment, not just visually checked. The company also offers a one-year free-repair commitment for eligible non-external defects arising during standard customer use.
Farway has served customers in transportation and automotive electronics, new energy, security, medical devices, communications, and other electronic product fields, working with more than 100 industry customers across more than 20 countries and regions. This cross-industry experience means Farway understands that an automotive sensor, a medical device, and an industrial controller each have different protection requirements — and the molding process, material selection, and testing plan need to match the end-use environment.
The low pressure molding process at Farway protects a range of electronic assemblies, including:
For each application type, Farway can adjust material grade, mold design, and testing protocol to match the specific environmental challenges the product will face.
Selecting a partner for low pressure molding PCBA involves looking beyond the molding step itself. The right manufacturer should handle the complete production chain, maintain relevant quality certifications, provide engineering input during design, and verify results through proper testing. Farway's combination of dedicated molding equipment, certified processes, engineering depth, and cross-industry experience addresses each of these requirements.
To discuss your low pressure molding project, contact Farway at sales@farway.hk or visit the contact page.
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