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What is the difference between low pressure molding and conformal coating

Author: Farway Electronic Time: 2026-08-14  Hits:

Electronic assemblies operate in environments where moisture, dust, chemicals, vibration, and temperature swings can degrade performance over time. Two of the most widely used protection methods in PCBA manufacturing are conformal coating and low pressure molding. While both shield circuit boards from environmental threats, they differ significantly in materials, process, thickness, level of protection, and ideal use cases. Understanding these differences helps engineers and procurement teams select the right protection strategy for their specific application.

What Is Conformal Coating?

Conformal coating is a thin polymeric film — typically 25 to 127 microns (1 to 5 mils) thick — applied to a completed circuit board. It conforms to the contours of the board and its components, creating a lightweight, transparent protective barrier against moisture, dust, chemicals, salt spray, and fungal growth.

Common conformal coating materials include:

  • Acrylic: Easy to apply and rework, good moisture resistance
  • Silicone: Excellent flexibility and high-temperature performance above 160°C
  • Polyurethane: Strong chemical resistance and abrasion protection
  • Epoxy: High durability but harder to rework

Application methods range from automated spraying and selective spraying to dipping, brushing, and manual aerosol application. The coating is then cured through solvent evaporation, heat, UV light, or a combination of these. Selective automated spraying is particularly useful when only specific areas of a board need protection while keeping connectors and test points uncovered. Farway Electronic's conformal coating service supports boards up to 550 mm × 470 mm with selective masking, double-sided spraying and baking, and both fan and needle spraying modes, achieving average spraying times of 0.5 to 3 minutes per board.

What Is Low Pressure Molding?

Low pressure molding (LPM) is an encapsulation process that uses polyamide hot-melt resins — typically derived from bio-sourced materials such as castor oil — to fully surround and seal electronic components. The resin is injected at low pressure (under 60 bar) and moderate temperatures (180°C to 230°C), forming a solid protective shell around the assembly.

Unlike conformal coating's thin film, LPM creates a thicker, three-dimensional overmold that provides superior mechanical, chemical, and environmental protection. The process is completed in as few as three steps and cycle times can be as short as 50 to 90 seconds, significantly faster than potting, which often requires 24 hours to cure.

LPM is particularly suited for applications requiring:

  • Waterproofing and IP-rated sealing
  • Strain relief for cables, connectors, and wire harnesses
  • Protection of sensors, switches, and microelectronics in harsh environments
  • Medical and automotive electronics where long-term durability is critical

Farway Electronic offers low pressure molding for electronics with support from technical consulting and engineering through product and mould development to full production, covering medical and industrial sensors, LED lighting, mobile-phone and power batteries, connector harnesses, circuit boards, and microswitches.

Key Differences: A Head-to-Head Comparison

Dimension Conformal Coating Low Pressure Molding
Thickness 25–127 microns (thin film) 1 mm and above (solid overmold)
Process Spray, dip, or brush; then cure Inject hot-melt resin into a mold
Cycle time Minutes to hours (curing dependent) 50–90 seconds per part
Application pressure Minimal (atmospheric application) Low (under 60 bar)
Processing temperature Room temperature to ~150°C curing 180°C–230°C injection
Weight added Minimal Moderate to significant
Transparency Usually transparent Opaque or colored
Reworkability Moderate (can be stripped or dissolved) Difficult (requires remelting)
Protection level Light to moderate environmental Heavy-duty; waterproof, vibration-resistant
Cost per unit Lower Higher; requires custom molds
Best suited for Dense PCBs, cost-sensitive runs Connectors, sensors, harsh environments

When to Choose Conformal Coating

Conformal coating is the right choice when you need lightweight, low-cost protection for populated PCBs operating in moderate environments. If the board encounters humidity, dust, or occasional condensation but is not submerged in water or subjected to heavy mechanical impact, a thin conformal film delivers adequate protection without adding bulk.

It is also preferred when:

  • Visual inspection of components beneath the coating is important
  • The production volume is high and per-board cost must stay low
  • Rework or repair access is a priority, since acrylic and silicone coatings can be removed
  • The board has dense component placement where a thick overmold would be impractical

For example, a communication device PCBA operating in an indoor environment benefits from conformal coating's thin, transparent barrier without the added bulk or cost of encapsulation.

When to Choose Low Pressure Molding

Low pressure molding is preferable when the assembly needs true waterproofing (IP67 or higher), mechanical stress relief, or a self-contained protective housing without a separate enclosure. Because LPM forms a solid, three-dimensional shell, it absorbs vibration, resists impact, and seals out water far more effectively than a thin film.

Typical LPM applications include:

  • Medical sensors that undergo sterilization and bodily fluid exposure
  • Automotive electronics subjected to road vibration and temperature extremes
  • LED lighting modules installed outdoors
  • Mobile-phone and power battery packs requiring impact resistance
  • Connector harnesses and cable assemblies needing strain relief at exit points

LPM also offers processing advantages over potting. Traditional potting involves mixing two-component compounds and waiting up to 24 hours for curing, whereas LPM uses a single-component thermoplastic resin that sets in under two minutes. This translates to higher throughput and lower labor costs per part.

Complementary, Not Competing

Conformal coating and low pressure molding are not mutually exclusive. In many product designs, a PCBA receives conformal coating first to protect the board-level circuitry, and then key connectors or cable exit points are overmolded with LPM for mechanical strain relief and environmental sealing. This combined approach leverages the strengths of both technologies — thin-film protection across the board surface plus heavy-duty encapsulation at vulnerable interfaces.

For manufacturers seeking a partner that offers both capabilities under one roof, Farway Electronic provides integrated PCBA manufacturing services — from PCB fabrication and SMT assembly through conformal coating, low pressure molding, functional testing, and finished product assembly. The company's production lines include two SMT lines, two DIP plug-in lines, one conformal-coating spraying line, four low-pressure injection moulding machines, and two finished-product assembly lines, all backed by ISO 9001, ISO 13485, and IATF 16949 quality management systems.

Conclusion

The difference between low pressure molding and conformal coating comes down to protection level, process, and application. Conformal coating delivers a thin, cost-effective barrier for moderate environments, while low pressure molding provides heavy-duty encapsulation for harsh conditions. By understanding the strengths and limitations of each method, engineers can make informed decisions that balance performance, cost, and reliability. Partnering with an experienced manufacturer like Farway Electronic ensures both technologies are available and correctly applied to meet your product's specific requirements.

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