Through-hole technology (THT) involves inserting component leads through drilled holes in the PCB and soldering them on the opposite side. This method creates a physical bond that passes entirely through the board, delivering superior mechanical retention compared to surface-mount pads. That strength matters in applications where boards face continuous vibration, thermal cycling, or physical stress — conditions common in transportation, industrial automation, and power electronics.
Components such as electrolytic capacitors, transformers, relays, terminal blocks, and large connectors are still predominantly through-hole parts because their size, weight, or pin configuration makes surface mounting impractical or unreliable. For these reasons, a capable through-hole assembly service remains a critical link in the electronics manufacturing chain.
Wave soldering is the dominant method for high-volume through-hole assembly because it solders all leads on a board in a single pass. Farway Electronic, a Shenzhen-based EMS provider, operates a published DIP process that runs from component forming through final functional testing. Each stage is designed to maintain solder joint integrity and assembly consistency:
Farway Electronic operates a dedicated through-hole manufacturing setup at its 2,000-square-metre facility in LongGang, Shenzhen. The published equipment list and line configuration reflect a production environment built for both prototype validation and repeat manufacturing:
This configuration supports boards up to 510 mm × 460 mm in PCBA size and accommodates through-hole components across a board thickness range of 0.2 mm to 8 mm. The process is governed by IPC-A-610 acceptance standards, ensuring that every solder joint meets recognized workmanship criteria.
Most modern electronic products combine surface-mount and through-hole components on the same PCB. Compact ICs and passive devices are surface-mounted for density, while connectors, transformers, and power components are through-hole mounted for durability. Farway supports this mixed-technology requirement with an integrated one-stop smt + dip assembly service that sequences both processes on a single board.
In a typical mixed-assembly workflow, smt pcb assembly is completed first — solder paste printing, component placement, and reflow soldering. The board then moves to the DIP line for through-hole insertion and wave soldering. Farway's two SMT lines, equipped with Yamaha placement machines and Jintuo ten-zone reflow ovens, feed directly into its DIP and wave-soldering lines, eliminating the need to split production across multiple vendors.
Solder joint reliability in through-hole assembly depends on disciplined inspection at every stage. Farway applies multiple inspection layers throughout the DIP process:
Farway's quality systems are backed by ISO 9001, ISO 13485, IATF 16949, and ISO 14001 certifications, covering quality management, medical devices, automotive industry requirements, and environmental management respectively. The company also holds UL, RoHS, SGS, and REACH compliance within its product certification scope.
Farway serves customers across industries where through-hole durability is non-negotiable. In transportation, through-hole boards handle automotive playback functions and window-lifter anti-pinch controls. In the security sector, alarm system PCBA assemblies rely on through-hole connectors for reliable field installation. Medical devices, communication equipment, and new energy products similarly depend on the mechanical robustness that through-hole soldering provides.
Since its establishment in 2018, Farway has served more than 100 industry customers across more than 20 countries and regions, building experience across these demanding application fields.
Wave soldering is one stage in a broader manufacturing sequence. After through-hole assembly, boards often require environmental protection and final packaging. Farway offers conformal coating to protect finished assemblies from moisture, dust, corrosion, and temperature extremes, with an automated spraying line that supports boards up to 550 mm × 470 mm. For sensitive components, low-pressure injection moulding provides additional encapsulation against water and mechanical stress.
The production chain extends to PCBA testing, finished-product and box-build assembly, and supporting engineering services including NPI, DFX review, program burning, stencil manufacturing, and fixture production. This end-to-end capability allows customers to move from prototype to packaged product under one roof.
Selecting a through-hole assembly partner comes down to three factors: equipment and line capacity, quality system maturity, and the ability to handle mixed-technology boards without splitting production. Farway's combination of Nitto wave-soldering equipment, IPC-A-610 compliance, multi-standard certifications, and integrated SMT-to-DIP lines addresses all three. Whether the requirement is a prototype from a single piece or a large-volume production run, the same controlled process applies.
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