| Method | What It Detects | Stage |
|---|---|---|
| SPI (Solder Paste Inspection) | Paste volume, height, alignment, bridging | Pre-reflow |
| AOI (Automated Optical Inspection) | Component presence, polarity, bridges, tombstones, solder geometry | Post-reflow |
| X-ray Inspection | Hidden joints, voids, barrel fill under BGAs | Post-assembly |
| FAI (First Article Inspection) | First-unit conformance to all specifications | NPI transition |
| ICT (In-Circuit Test) | Component values, opens, shorts at structural level | Post-assembly |
| FCT (Functional Test) | System behavior against design requirements | End-of-line |
| Thermal Imaging | Hot spots, thermal anomalies under load | Reliability screening |
| High/Low-Temperature Testing | Performance across operating temperature range | Reliability qualification |
1. Vertical scope. Can the manufacturer fabricate PCBs, source components, perform SMT and DIP assembly, run a full inspection and test stack, apply conformal coating, execute low-pressure injection moulding, and complete box-build assembly all in-house? Each stage outsourced to a third party is a gap in accountability.
2. Certification stack. Verify current ISO 9001, ISO 13485, IATF 16949, and ISO 14001 certificates with stated scope. Request audit reports and confirm that UL, RoHS, SGS, and REACH compliance covers the product certifications relevant to your industry.
3. Equipment and capacity. Count the production lines: two SMT lines, two DIP lines, one conformal-coating line, two finished-product assembly lines, and four low-pressure injection moulding machines are concrete figures. Ask to see Yamaha placement machines, Jintuo reflow equipment, and Nitto wave-soldering equipment on the factory floor.
4. Test coverage. Request sample AOI and X-ray image packs. Ask for ICT coverage maps and FCT procedure documents. Confirm whether SPI, FAI, thermal imaging, and high-low temperature reliability testing are standard or optional, and what serialization and data capture capabilities exist for traceability.
5. PCB capability range. Confirm board types supported (rigid, flexible, rigid-flex), layer count range, material options, minimum line width and spacing, maximum board size, and surface-treatment options. A partner that can handle 01005 components and BGA pitch down to 0.2 mm demonstrates advanced placement precision.
6. Sourcing controls. Ask about authorized distributor channels, incoming inspection procedures, ERP-managed inventory systems, anti-static and humidity-controlled warehousing, and counterfeit-component mitigation policies. Request evidence of BOM risk-checking procedures.
7. Industry track record. How many customers in transportation, new energy, medical, security, communications, and AI have been served? Across how many countries? A partner serving more than one hundred industry customers across more than twenty countries has navigated the regulatory and quality requirements your product will encounter.
8. NPI and engineering support. New Product Introduction capability matters as much as volume production. Ask about DFX review, program burning, stencil fabrication, fixture production, and the engineering team's coverage across electronic, BOM, structural, procurement, and testing disciplines.
Farway Electronic operates a 2,000-square-metre production workshop in Shenzhen's LongGang district, equipped with two SMT lines, two DIP lines, automated conformal coating, four low-pressure injection moulding machines, and a comprehensive testing ecosystem from SPI through functional and reliability testing. With ISO 9001, ISO 13485, IATF 16949, and ISO 14001 certifications and a track record of serving customers across more than twenty countries, the company supports prototype, medium-volume, and large-volume orders across transportation, new energy, medical, security, communications, and AI product categories. If your next build requires a manufacturing partner that owns the entire chain from bare board to shipped product, contact the Farway team to discuss your requirements.