Low pressure coating might sound complex, but its process is surprisingly straightforward—especially when partnered with an experienced manufacturer. Here's a breakdown of the key steps:
1. PCB Preparation:
Before coating, the PCB is cleaned to remove dust, oils, or flux residues that could interfere with resin adhesion. Sensitive components (like connectors or LEDs that need to remain accessible) are masked off with tape or custom fixtures.
2. Mold Design:
A custom mold is created based on the PCB's dimensions. The mold is typically made of aluminum or steel and split into two halves, with cavities that match the board's shape. This ensures the resin flows exactly where it needs to, without covering critical areas.
3. Resin Selection:
The right resin is key. For salt fog resistance, manufacturers often choose polyamide-based resins, which offer excellent chemical resistance and flexibility. Some resins are also RoHS compliant, a must for global markets. This is where
rohs compliant pcba low pressure coating becomes a selling point for eco-conscious brands.
4. Injection Molding:
The PCB is placed into the mold, which is then clamped shut. Molten resin is injected into the mold at low pressure—just enough to fill the cavities without damaging delicate components. The low pressure ensures no air bubbles form, which could create weak spots for salt fog to attack.
5. Curing and Demolding:
The resin cools and cures (either at room temperature or with mild heat) in minutes. Once solidified, the mold is opened, and the coated PCB is removed. Any excess resin is trimmed, and masked components are uncovered. The result? A PCB encased in a seamless, protective shell.
6. Post-Processing Testing:
Before shipping, the coated PCB undergoes rigorous testing, including adhesion checks, flexibility tests, and (of course) salt fog exposure. This final step gives manufacturers peace of mind that the coating will perform when it matters most.