Low pressure injection coating, often abbreviated as LPIC, is a manufacturing process that encases electronic components—like PCBs—within a protective polymer layer. Unlike traditional high-pressure molding, which can damage delicate parts, LPIC uses low pressure (typically 1-5 bar) to inject molten polymer material around the PCB. This gentle approach ensures that even the smallest components, such as microchips or thin wires, remain intact while being fully encapsulated.
The materials used in LPIC are usually thermoplastic elastomers (TPEs) or polyamides, chosen for their flexibility, chemical resistance, and ability to form a tight, seamless bond with the PCB. Once cured, the result is a durable, conformal layer that conforms precisely to the shape of the electronics, leaving no gaps for moisture, dust, or contaminants to seep in.

