With setup complete, it's time to start the test. But "set it and forget it" is a risky mindset here—even small deviations can skew results.
Ramp Up Temperature Gradually:
Sudden temperature spikes can shock components, causing thermal expansion that mimics a failure. Aim for a ramp rate of 1-2°C per minute until you reach your target. For example, if testing at 100°C, start at 25°C and increase by 1°C every 30 seconds over 75 minutes.
Monitor Continuously:
Track temperature, voltage, current, and any functional outputs (e.g., LED status, sensor readings) in real time. Tools like data loggers or PC-based monitoring software (some
turnkey SMT PCB assembly services
offer proprietary tools for this) can alert you to anomalies—like a sudden drop in current that might signal a short circuit.
Log Everything:
Even if no failures occur, detailed logs are gold. Note the start/end times, temperature fluctuations, voltage stability, and any observed behavior (e.g., "Board B-3 began drawing 10mA more after 12 hours"). This data helps refine future tests and provides documentation for clients or regulatory bodies (e.g., FDA for medical devices).
Handle Failures Carefully:
If a PCB fails mid-test, don't just toss it aside. Power down the chamber, remove the board, and diagnose the root cause. Is it a blown capacitor? A cracked solder joint? This info feeds back into your assembly process—maybe your soldering iron temperature was off, or a batch of components was defective. A good
reliable SMT contract manufacturer
will use failure data to improve their workflows, reducing future defects.